WTV Adhesive
The WTV series adhesive is a composite adhesive developed by combining the advantages of inorganic and organic adhesives.
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Performance Characteristics

  • High strength

  • Good toughness

  • Anti-aging

  • High temperature resistance

  • Excellent flame retardancy

  • Corrosion resistance

  • Superior thermal shock resistance


The WTV series adhesive is a composite adhesive developed by combining the advantages of inorganic and organic adhesives. Its core principle is to enhance tensile strength and lap shear strength by abandoning traditional toughening modifiers. Through a series of systematic variable tests, a novel toughening agent was selected—one that participates in the curing reaction, exhibits excellent compatibility, and contains activated flexible factors. This results in a molecular structure that not only incorporates end-capped groups with outstanding toughening effects and aging resistance but also includes multiple flexible segments to mitigate brittleness.


This adhesive significantly improves impact toughness and reduces internal stress during curing while maintaining heat resistance and modulus. Notably, it excels in scenarios involving rapid thermal cycling (e.g., sudden heating/cooling of equipment). Its modified microfiber structure achieves a thermal expansion coefficient (9×10⁻⁶ m/m·K) intermediate between steel and ceramics. The unique flexible fibers effectively compensate for mismatched thermal expansion between ceramics and steel, alleviating stress on ceramics and ensuring long-term adhesion even in harsh environments.


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The WTVH series adhesive is primarily composed of inorganic salts, inorganic acids, inorganic bases, metal oxides, hydroxides, etc. To enhance its bonding strength, toughening agents and special adhesion promoters are incorporated through blending, copolymerization, or grafting. Reinforcing fillers are added, and crosslinking density is increased to improve the adhesive's thermal stability. The curing process and physicochemical changes upon heating are as follows:


At low to medium temperatures, chemical bonding adhesion occurs, enabling the adhesive to react with the bonded interface. Through intermolecular interpenetration, the adhesive solidifies into a unified structure.


At high temperatures, lattice transformation into ceramic sintering provides high-temperature strength. This adhesive is designed for high-temperature applications, specifically for embedding and gap-filling bonding between ceramics and metal substrates.


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